IEC e-Tech
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This new emerging field is particularly energy
efficient and promising. While some standards for it already exist, more will
be required.
The number of devices connected to the internet is projected
to reach 40 billion worldwide as we move into the era of the Internet
of Things (IoT) and, even more so, what some pundits call the Intelligence of
Things. Forecasts suggest this could put
a strain on global energy use and count for as high as 25% of all energy
consumption as soon as 2030. Currently, connected devices do not compare to
power-hungry sectors such as transport or buildings, at an only five to seven
estimated percentage of total energy consumption. But with the huge predicted
growth, energy requirements are expected to escalate.
This increased demand was anticipated by some researchers
theorizing the IoT a couple of decades ago. They foresaw that the exponential
rise of the IoT and the concomitant increase in energy used to power billions
of microelectronic devices required a new approach. And one of the results of
this new approach is the burgeoning field of ultra-low power microcontroller,
or ULP MCU, systems.
“It became apparent that for the IoT to be realized, we
couldn’t continue to use traditional and in some cases energy-intensive
approaches for electronic devices,” says IEC expert Leszek A. Majewski,
who chairs the technical committee which prepares standards for printed
electronics, IEC TC 119. He is also a lecturer in electrical and
electronic engineering at the University of Manchester and has a PhD in the
development of low-voltage organic field-effect transistors.
“Although lithium-ion batteries and lithium-polymer batteries
are currently being developed with smaller form factors and greater energy
storage capacity for gadgets like smart home sensors, the increase in demand
for new microelectronic applications in industrial monitoring, healthcare and
space exploration requires approaches based on new materials and structures
where batteries are not necessarily the answer,” he confirms.
ULP MCU systems fit in with this new approach. They are
deemed essential to facilitate the growth of the IoT and the success of new
applications which require extended operation without frequent charging or
battery replacement and are often in discrete form factors.
A booming market and a hot topic
The value of the global ULP MCU market is forecast to
hit USD 15,27 billion in 2030, driven by the rising adoption of
devices such as consumer wearables, medical monitors and IoT sensors. “It’s a
very hot topic and also a pretty wide field in terms of the new materials and
techniques being explored,” adds Majewski. “In order for microelectronic
devices to work, they need to be on pretty much all the time. Depending on the
function, always-on devices would have to draw a minimum amount of power to
stay on as long as possible. You don't want to have to change them in the
field. You want to minimize maintenance.”
Consequently, ULP MCU devices need to be operated with very
low supply voltages of 1 V or lower and consume minimal power, typically
measured in milli- or microwatts. This significantly decreases power
consumption amid rising energy costs.
Engineering challenges for ULP design
Since a lower-power device cannot generate, store or
transmit vast amounts of data, the principal limitation is that its
functionality needs to be simple. According to Majewski, depending on use, the
design of a ULP device will often have to balance size and reliability against
energy efficiency and performance.
“The range of the device is limited since the signals cannot
be sent far, but you accept that this is an inherent property of a low-power
device that you design for. You do not expect it to deliver a huge output. So,
it must be something really basic with one or two parameters. Many of these
devices are for new use cases that we would never imagine without low power.”
Ingestible devices are one of the applications
One example are ingestible electrochemical
sensors, which can be swallowed to monitor health and detect disease as they
pass through the body. Electronics can now be directly integrated into moulded
plastic objects and devices. In-mold electronics (IME) is driven by the
automotive industry because it “significantly reduces the cost, weight, waste
and energy required to produce vehicle interior parts,” according to
the group which has standardized its development.
IMEs can include all the surface-mounted devices
included in traditional electronics to increase functionality, such as sensors,
LEDs and microcontrollers. “You could integrate an array of micro low-power
devices, like a matrix of transistor-based sensors, which can increase an
application’s sophistication and capacity but will also increase power
consumption,” Majewski says.
One avenue of enquiry proving particularly beneficial to
wearables is that of e-textiles. Consisting of woven networks of flexible
fibres, e-textiles can be readily deformed into stretchable, flexible form
factors. This makes them ideal for use in wearables like smart watches which
require motion tracking of human body’s physical or mechanical movements.
Rather than using hard substances like silicon to make
transistors, organic soft matter is an emerging field of research.
“Skin-like soft electronics offer conformal, stable interfaces with biological
tissues – including skin, heart, brain, muscle and gut – enabling health
monitoring, disease diagnosis and closed-loop therapeutic interventions,”
researchers explain.
Energy harvesting works for ULP devices
Energy harvesting is the process of capturing and
converting energy from the environment into electrical power, in principle as a
perpetual and sustainable power source. It is a particularly energy efficient
source of energy, as it can be even derived from body movement or heat. “There
are a variety of methods to achieve it, and each one will convert the source
power into usable energy in a different way,” explains Majewski. “Energy can be
harvested from radio waves via a radio frequency (RF) antenna or heat via an
infrared (IR) optical rectenna, for example.”
Thermal sensors on vehicles can harvest the radiant heat
from the road surface. Other sensors on moving vehicles could obtain power from
the motion energy “if placed in high-vibration locations, such as near the
wheels or engine components.”
Similarly, energy for wearable devices can be powered by the
kinetic movement of the body (piezoelectric) or from body
heat or body fluids. Research shows that body-powered
kinetic motion could add 10 mW to the primary power source for ULP MCUs.
“In the design of e-textiles you would take account of
energy generation from a variety of mechanisms including thermoelectric
generators that harvest body heat or you could use materials that incorporate
solar cells. The use of piezoelectric mechanisms show particular potential for
wearables since just the basic squeeze of the material will generate energy,”
Majewski explains.
“However, all of these technologies are currently limited in
terms of the amount of energy they are able to generate and in the consistency
of energy generation. Consequently, energy harvesting for ULP MCUs is currently
for use in limited applications, such as augmenting [extending] battery life,”
he adds.
Wireless charging and data transmission
A number of wireless solutions for power delivery are
gaining market adoption. These include the Wireless Power Consortium’s Qi
standard (Qi2 and Qi2 25W versions) for wireless charging of mobile,
handheld electronic devices and NFC Wireless Charging (NFC WLC) supporting
lower power 1 W applications over a distance of 2 cm. Backed by the NFC
Forum, the latest NFC wireless charging specification supports Qi induction
charging platform, which delivers up to 15 W over a distance of 4 cm.
“Devices can be powered using near field communication (NFC)
via an RF type of antenna,” explains Majewski. “The device is dormant, and
until it is activated for a short period of time, it turns itself off again.”
Technologies like Bluetooth Low Energy (BLE), Wi-Fi 6 and Zigbee
are already designed to minimize radio-on time and therefore keep
power needs to a minimum.
Existing IEC Standards and new ones required
The IEC is also paving the way for this new technology and
has embarked in this field within several of its technical committees. TC 119
standardizes materials, processes, equipment and products for printed
electronics. The TC is working on the first edition of IEC 62899-202-13,
which contains measures for the conductive layer in IME
and tests of printed thin-film transistor-based pressure sensors.
Printed electronics technology is not only low-cost but
sustainable, says Majewski. “It is generating a lot of interest in
manufacturing circles. TC 119 is therefore a key source of safety and
performance standards for such technologies.”
IEC TC 124 publications relate to wearable
applications, and there is ongoing work on the standardization of low-power
electronics, according to Majewski. Further, TS 60747-19-2 provides a
guideline for the specifications of a low-power sensor allowing autonomous
power supply operation. It also provides a guideline for specifications of the
power supply to drive smart sensors in a smart sensing unit. It is published by IEC
TC 47 which, among many things, standardizes discrete semiconductors and
sensors. It also publishes the IEC 62830-1 series, which includes
methods for evaluating the performance of vibration-based piezoelectric energy
harvesting devices.
Standards for piezoelectric technology are also developed
by IEC TC 49, which addresses piezoelectric, dielectric and electrostatic
devices. This includes IEC TS 61994-5, which gives the terms and
definitions for sensors, intended for manufacturing piezoelectric elements,
cells, modules and the systems.
ISO/IEC JTC 1/SC 41 is a joint subcommittee established
between ISO and the IEC to standardize all aspects relating to the
IoT, and therefore offers guidelines on the testing of IoT devices, including
networks of sensors. “Standardization at the IEC tends to focus on test methods
so that can we can ensure a particular device behaves as intended,” Majewski
says. “But we need further research to consider the low-power options of new
materials including, for example, human body tissues,” he concludes.
Energy – especially ultra-low-power forms of it – can indeed
be sourced anywhere and everywhere. This opens up new opportunities for
standardization bodies, but also for our future energy requirements in the race
to meet our net-zero targets.
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